Advanced Materials for AI Compute Infrastructure
Reducing Resistivity Across AI Compute, Data Center Infrastructure, and Energy Systems
As computing density and power demand rise, electrical resistivity increasingly limits performance by driving energy loss, heat generation, signal delay, and reliability challenges across chips, advanced packaging, printed circuit boards, and power delivery networks. Chiral develops passive nanometric layers and metallic conductors, including copper, that align electron spin at room temperature to reduce resistivity and improve conductivity.
Designed as drop-in additives and precursors, Chiral’s materials integrate with established semiconductor manufacturing processes, including electroplating and thin-film deposition, supporting adoption without changes to device architecture. Chiral’s spin-aligning copper has demonstrated higher conductivity in thin-film conductors, with benefits for interconnect performance, power delivery, self-heating, and reliability. The company is collaborating with leading semiconductor and computing companies and is also applying the same platform to energy systems, including electrolyzers, where it can increase hydrogen output or reduce power consumption.